2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

The 26th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2013) will be held in Taipei, Taiwan on January 20 – 24, 2013 at the Taipei International Convention Center (TICC). IEEE MEMS is one of the premier annual events reporting research results on every aspect of microsystems technology. This conference reflects the rapid proliferation of the commitment and success of the microsystems research community. Recently, the IEEE MEMS Conference has attracted more than 700 participants, 950+ abstract submissions and has created a forum to present over 300 peer-reviewed, top-quality papers in podium and poster/oral sessions.
The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:

Fabrication Technologies
Packaging Technologies
Materials and Device Characterization
Mechanical Sensors and Systems
Physical MEMS
RF MEMS
Bio & Chemical Micro Sensors & Systems
Medical Microsystems
Micro-Fluidic Components and Systems
Micro-Actuators
Energy Harvesting and Power MEMS
Nano-Electro-Mechanical Devices and Systems
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:

Mechanical, thermal, and magnetic sensors and actuators, and system
Opto-mechanical microdevices and microsystems
Fluidic microcomponents and microsystems
Microdevices for data storage
Microdevices for biomedical engineering
Micro chemical analysis systems
Microdevices and systems for wireless communication
Microdevices for power supply and energy harvesting
Nano-electro-mechanical devices and systems
Scientific microinstruments