The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025)

Added by academicx on 2024-11-28

Conference Dates:

Start Date Start Date: 2025-01-04
Last Date Last Day: 2025-01-06
Deadline for abstracts/proposals Deadline for abstracts/proposals: 2024-12-25

Conference Contact Info:

Contact Person Contact Person: Rolin
Email Email: [email protected]
Address Address: No.18 Haiyun Road, Dadonghai Tourism Area, Sanya, Hainan, China, Sanya, China, China
Phone Tel: +86 155 2742 6990

Conference Description:

The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025)
Website?https://www.academicx.org/ICMT T/2025/
Date?January 4-6, 2025
Venue? Sanya, China

The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025) will be held in Sanya, China on January 4-6, 2025. This conference will cover issues on microwave and terahertz technology. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.

Sanya is superior in geography climate and natural resources. It is known as “the oriental Hawaii" and “Sunshine City” because of its special tropical scenes as well as its attractive nature. Sanya's tourist resources, richly endowed by nature, are not only special in China, but also rare in the world. It is a most fashionable place where tropical marine tourist resources are closely concentrated and lovers of swimming can enjoy their holidays in winter. Within the city, well-known tourist spots are dotted everywhere--the national Yalong Tourist Area, the Tianyahaijiao, the Great Eastern Sea, the Luhuitou Peninsula, Sanya Bay and the Luobi Grotto. Besides these, there remain the ancient Yazhou City and relics and a sculpture of the Monk Jianzhen of the Tang Dynasty, who landed ashore to avoid the storm when he was sailing eastwards to Japan.



Attendance Methods
1.Regular Attendance ( No Submission Required )
You're also welcome to attend our conference (without submitting full paper or abstract)
2.Abstract submission
Submit abstract ( Regular Attendance + Abstract + Presentation )
You are welcome to submit abstract for oral presentation or poster presentation.
3. Full Paper submission
Submit full paper ( Regular Attendance + Paper Publication + Presentation )
You are invited to submit papers and participate in our academic exchange. One author will be invited to make an oral presentation and the paper will be published by peer-reviewed open access journal.
Publication and Presentation
Publication: All the accepted papers will be published by a peer-reviewed open access journal that can ensure the widest dissemination of your published work
Note: 1. If you want to present your research results but do NOT wish to publish a paper, you may simply submit an Abstract.
2.The simple Abstract submission should include the title, contents, keywords, authors names, affiliations and emails. The length is suggested to be controlled within 1 page and no more than 2 pages.
3.The full length of one paper is suggested to be about 15 pages (within the template format with all tables, figures and references). If your paper is over 20 pages, you will be kindly requested to pay for extra pages fees.
4. You will receive the review results within 3-5 working days after submission. If you do not get any notification within the time limit, please contact us as soon as possible.
5. You are welcome to submit papers in Chinese and please contact us for more details.

Contact Us
Email: [email protected]
Whatsapp: 0086 18672346485
Tel: +86 155 2742 6990
QQ: 1349406763
WeChat: 3025797047 / 15527426990
Official Account: Academic Communications

Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:
Microwave Field and Techniques
Field Analysis and Guided Waves
Frequency-Domain EM Analysis Techniques
Time-Domain EM Analysis Techniques
CAD Algorithms and Techniques
Linear Device Modeling
Nonlinear Device Modeling
Nonlinear Circuit and System Simulation

Microwave Passive Components
Transmission Line Elements
Passive Circuit Elements
Planar Passive Filters and Multiplexers
Non-planar Passive Filters and Multiplexers
Active, Tunable and Integrated Filters
Ferroelectric, Ferrite and Acoustic Wave Components
MEMS Components and Technologies

Microwave Active Components
Semiconductor Devices and Monolithic ICs
Signal Generation
Frequency Conversion and Control
HF, VHF and UHF Technologies and Applications
Power Amplifier Devices and Circuits
High-Power Amplifiers
Low Noise Components and Receivers
Mm-Wave and THz Components and Technologies

Microwave Systems and Applications
Microwave Photonics
Mixed Mode and Digital Signal Processing Circuits and Systems
Packaging, Interconnects, MCMs and Integration
Instrumentation and Measurement Techniques
Biological Effects and Medical Applications
Arrays as Antennas and Power Combiners
Radar and Broadband Communication Systems
Wireless and Cellular Communication Systems
Sensors and Sensor Systems
RFID Technologies
High Power Microwave Industrial Applications

Emerging Technical Areas of Microwave
RF Nanotechnology
Wireless Power Transmission
New Technologies and Applications
Innovative Systems
Microwave/RF Devices for Wireless Health Care Applications

Terahertz Theory and Technology
Terahertz Devices: Electronics/Photonics/Plasmonics
Terahertz Generation, Propagation, and Interaction
Passive Components and Materials Issues in Terahertz
Terahertz Imaging
Terahertz Sources, Detectors and Receivers
Terahertz System Architectures and Distributed Networks
Terahertz Diagnostics
Terahertz Nanoelectronics
Terahertz Spectroscopy
Terahertz Systems
Advanced Materials and Concepts (E.G., Metamaterials, Memristor)
Novel Concepts (E.G., Plasmonic THz, Quantum Cascade Lasers)
Terahertz to Optical Metamaterials, Assemblies, and Systems
New Frontiers and Recent Breakthroughs in Terahertz Research

Novel Applications of Terahertz
VLSI Trustworthiness and Inspection – Counterfeit IC Detection
Industrial Inspection
Security and Military
Biomedical
Information Processing and Computing
Electronics/Information/Communication Systems
Integration of Advanced Materials with Conventional Devices and Systems
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