Conference Description:

We are delighted to welcome you to the 2024 International Conference on Science and Engineering of Electronics (ICSEE 2024), which will be held in Wuhan, China, from November 22nd to 26th, 2024, and promoted by the open access MDPI journal Electronics (ISSN: 2079-9292; IF: 2.9).

This conference offers a platform for experts, scholars, and engineers in the field of electronics science and engineering to engage in an exchange of ideas and share cutting-edge research findings. The conference will encompass diverse facets of electronics science and engineering, including, but not limited to, the following:

S1. Theories and Methodologies in Electronics.
S2. Electronic Materials and Devices.
S3. Circuits and Systems.
S4. Communications and Networks.
S5. Electronic Systems and Embedded Systems.
S6. Nanotechnology Electronics.
S7. Signal Processing and Applications.
S8. Control, Robotics and Autonomous Systems.
S9. Deep Learning and Data Analytics in Electronics.
S10. Cybersecurity in Systems.
S11. Artificial Intelligence for Electronics.
S12. Machine and Computer Vision for Electronics.
S13. Power Electronics, Electrical Grid and Energy Systems.
S14. Microelectronics (Miniaturized Electronic Devices and Systems, Silicon Chips, and Integrated Circuits).
S15. Millimeter and Terahertz Wave Technology.
S16. Biomedical Electronics.
S17. Smart Electronics.
S18. Instrumentation and Measurement.
S19. Electronics for Agriculture.
S20. Quantum Technology.

We are excited to have this opportunity to explore the latest developments and future trends in the field of electronics science and engineering alongside experts, scholars, and engineers from around the world. We firmly believe that this conference will serve as a valuable platform for exchange and cooperation, fostering the development and progression of electronics science and engineering.

Lastly, we would like to express our sincere gratitude for your unwavering support and participation, while wishing this conference great success!

Kind regards,
Prof. Dr. Ying Tan
Department of Machine Intelligence, School of EECS, Peking University, Beijing, China