Conference Description:

[EI/Scopus] 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024)
-Important information
Conference date: May 10-12, 2024
Conference Venue: Nanchang, China
Conference website: http://www.aemcse.org

-Introduction
The 2024 7th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2024) will be held in Nanchang, China on May 10-12, 2024. AEMCSE is proud to host a global gathering of theorists and experts in Advanced Electronic Materials, Computers and Software Engineering in the highly complex field of knowledge and software engineering, which brings researchers, practitioners, and scientists in discussion of the latest methods, research developments, and future opportunities. This event will include the participation of renowned keynote speakers, oral presentations, posters sessions and so on.
If you do not need to publish any paper, you may attend our conference as oral/poster presenter, or listener. AEMCSE 2024 welcomes submission of researches concerning any branch of Advanced Electronic Materials, Computers and Software Engineering.

-Committee
Conference General Chair
Prof. Xiaolin Qiu, Nanchang Institute of Technology, China
Prof. Wenjun Tan, Northeastern University, China
Technical Program Committee Chair
Prof. Guandong Xu, University of Technology Sydney, Australia
Organizing Committee Chair
Prof. YanbinFan, Nanchang Institute of Technology, China
Publication Chair
Prof. Lvqing Yang, Xiamen University, China

-Call For Papers
Computer Engineering)
Microprocessor and Microcontroller Design
Computer System Integration
FPGA and ASIC Design
Computer Network Security Technologies
Embedded Systems
Computer Engineering
Microprocessor and Microcontroller Design
Computer System Integration
FPGA and ASIC Design
Computer Network Security Technologies
Embedded Systems
Software Engineering
Software Development Lifecycle
Agile and DevOps Practices
Cloud Computing Services and Architecture
Artificial Intelligence in Software Development
Software Project Management and Quality Assurance
-Advanced Electronic Materials
High-frequency Electronic Materials
Semiconductor Materials and Devices
Electronic Packaging Materials
Nano-electronic Materials
Flexible Electronic Materials

-Publication
All accepted full papers will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) and will be submitted to EI Compendex / Scopus for indexing.

-Submission
You can submit your paper (word+pdf) via Electronic Submission System
https://www.ais.cn/attendees/paperSubm it/FMV6JN
Paper Requirements
1.Please follow the Manuscript template to write:
http://www.aemcse.org/download
2.All submissions must not be less than 5 pages and not exceed 10 pages in length.
3.The article should be original writing that enhances the existing body of knowledge in the given subject area.
4.Results reported have not been submitted or published elsewhere .
5. Experiments, statistics, and other analyses are performed to a high technical standard and are described in sufficient detail.
6.Conclusions are presented in an appropriate fashion and are supported by the data.
7.The article is presented in an intelligible fashion and is written in Standard English.
8. Appropriate references to related prior published works must be included.

-Contact
Ms. Kwok
Tel: +86-18124944750 (WeChat)
QQ?2152116918
E-Mail: [email protected]