ICEAI 2024 International Congress on Engineering and Information
Added by pro_hef2010 on 2024-03-08
Conference Dates:
Start Date: 2024-11-21Last Day: 2024-11-23
Deadline for abstracts/proposals: 2024-07-20
Conference Contact Info:
Contact Person: AvaEmail: [email protected]
Address: No.2, SongShou Road, Taipei, Taiwan, 110061, Taipei, Taiwan
Conference Description:
We are thrilled to extend a warm invitation to you for the 10th International Congress on Engineering and Information (ICEAI), set to take place in vibrant Taipei, Taiwan, from November 21st to 23rd, 2024. As the premier event in the field of engineering and information, ICEAI promises to be a gathering of minds where cutting-edge research, innovative technologies, and transformative ideas converge.We are particularly excited to announce a special session at ICEAI, titled "Interdisciplinary Innovations: Exploring Semiconductors, AI, and Sustainability." This thematic focus aims to facilitate cross-disciplinary exchange and collaboration between the realms of semiconductors, artificial intelligence (AI), and sustainable technologies. By bringing together researchers and industry experts, this session provides a unique platform to share achievements, address challenges, and explore best practices in integrating semiconductor technology, AI, and sustainability.
This special session theme aims to facilitate cross-disciplinary exchange and collaboration between semiconductors, artificial intelligence (AI), and sustainable technologies. Through this theme, researchers and industry experts can share their achievements, challenges, and best practices in integrating semiconductor technology, AI, and sustainable technologies.
Join us at ICEAI as we embark on a journey of discovery and innovation, shaping the future of engineering and information together. Your participation will enrich the conference experience and contribute to the advancement of interdisciplinary research and practices.
This conference also includes multiple sessions related to the academic fields of engineering and information. We encourage researchers from both industry and academia who have expertise in following listed(but not limited) areas to submit their contributions.