Conference Description:

2024 4th International Conference on Electronic Materials and Information Engineering (EMIE 2024) will be held in Guangzhou, China from May 24 to 26, 2024.

EMIE 2024 is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.

---Call For Papers---
The topics of interest for submission include, but are not limited to:
(a) Electronic materials
- Physical chemistry
- Semiconductor material
- Conductive metals and their alloys
- Electromagnetic shielding material
- Dielectric material
- Piezoelectric and ferroelectric materials
- Magnetic material
- Optoelectronic material
- Integrated circuit
- Electronic information computer materials

(b) Information engineering
- Electronic science and technology
- Information and communication Engineering
- Optoelectronic information science and technology
- Engineering optics
- Information optics
- Electronic technology
- Photoelectric technology
- Communication technology
- Measurement and control technology
- Computer application technology

All accepted full papers will be published on Conference Proceedings and submitted to EI Compendex and Scopus for indexing.

Important Dates:
Full Paper Submission Date: March 12, 2024
Registration Deadline: May 22, 2024
Final Paper Submission Date: April 23, 2024
Conference Dates: May 24-26, 2024

For More Details please visit:
https://ais.cn/u/AziiA3

Invitation code: AISCONF
*Using the invitation code on submission system/registration can get priority review and feedback