Conference Description:

With great pleasure, we announce the 2024 IEEE 13th International Conference on Engineering Education (ICEED2024), which will be held from the 19th to the 20th of November 2024 in Kanazawa, Japan. ICEED 2024 will be organized by IEEE Education Society Malaysia Chapter and co-organized by Engineering and Technical Research Group (EnTER), School of Electrical Engineering, University Teknologi MARA, Shah Alam Malaysia and Kanazawa Institute of Technology (KIT).

Authors are invited to submit full papers describing original research. Areas of interest include, but are not limited to the following tracks:

Track
• Accreditation and evaluation
• Engineering Education Reforms
• International Recognition of Qualifications
• New Technologies in Engineering Education
• Industry and Education Collaboration
• Globalisation in Education
• Women in Engineering Education
• Changes and Challenges in Engineering Education
• Computer and Web based software
• Distance learning: methods, technologies, and assessment
• Outcome-Based Education
• Linking Academic Knowledge with the Industrial Needs
• Research and development in Engineering Education
• Quality Assurance in Engineering Education
• Education in Applied Sciences
• Education in Social Sciences
• Education in Life Science

Publication
The proceedings of ICEED 2024 may be eligible for inclusion in the IEEE Xplore® Digital Library, once they meet the requirements of an IEEE quality review.

Important Dates
Submission Deadline (Full Paper): 1st May 2024
Notification of Acceptance: 30th June 2024
Early Bird Registration Deadline: 15th September 2024
Final Paper Submission Deadline: 15th October 2024
Final Registration Deadline: 15th October 2024
Conference Date: 19th – 20th November 2024


To submit your manuscript, please go to this link: https://enter.uitm.edu.my/iceed/submissi on/


For more information, please visit ICEED website: https://enter.uitm.edu.my/iceed/