International Conference on Engineering Technology,Computing, and Smart Materials (ETCSM-APRIL-2022)

Added by CEAS on 2021-12-23

Conference Dates:

Start Date Start Date: 2022-04-23
Last Date Last Day: 2022-04-24
Deadline for abstracts/proposals Deadline for abstracts/proposals: 2022-04-15

Conference Contact Info:

Contact Person Contact Person: Xiao wei
Email Email: [email protected]
Address Address: Holiday Villa Beach Resort & Spa Langkawi Kedah, Malaysia, Malaysia

Conference Description:

The Conference organizing committee invites Scholars /Scientists / Engineers/ Researchers / Practitioners / Students worldwide to submit papers and share the valuable experiences on this platform.

All submitted abstracts/ papers / posters will go through a blind peer review process and accepted manuscripts will be published in ISBN: 9979-53-7912-6 conference proceedings. Accepted manuscripts are published in ISBN conference proceedings. Conference proceeding are submitted to Indexation agencies.

All selected conference papers will be published free of cost in our associated journals that are having unique ISSN and Published on quarterly basis. These journals are indexed by:

Google Scholar
CrossRef
Doi System

RACEI Conference scope covers, but not limited to, the following topics:

Main Tracks of the conferences:

Track 1- Computer and Software Engineering

Track 2- Mechanical & Metallurgical Engineering

Track 3- Electrical & Electronics Engineering

Track 4- Civil Engineering

Track 5- Bio-Technology & Food Technology

Track 6- Chemistry & Chemical Engineering

Track 7- Physical, Applied and Life Sciences

Track 8- Interdisciplinary
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