2021 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)
Added by Chapman on 2020-08-19
Conference Dates:
Start Date: 2021-05-10
Last Day: 2021-05-12
Deadline for abstracts/proposals: 2021-03-15Conference Contact Info:
Contact Person: Ms. Serene Lo
Email: [email protected]
Address:
Osaka, Osaka, Japan
Tel: +86-028-83208181 
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Conference Description:
Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31
{ Submission Method }
1. Send your manuscript directly to conference official email: [email protected]
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icme e2021