IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)
Added by Sara on 2018-03-05
Conference Dates:
Start Date: 2018-11-24Last Day: 2018-11-26
Deadline for abstracts/proposals: 2018-09-30
Conference Contact Info:
Contact Person: Ms Sissi ChanEmail: [email protected]
Address: Shanghai, Shanghai, China
Tel: +86-28-87777577
Conference Description:
(For early submission, it will get the feedback within 1month)==Publication: IEEE Conference Proceeding
==Indexed by: IEEE Xplore, Ei Compendex, and Scopus*
==Submission email:[email protected] (Or you still can submit to the submission system on website)
==Find the tempalte with the link:http://www.icicm.net/Template.doc
Keynote Speakers & Invited Speakers:
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA;
Prof. Gene Eu (Ching Yuh) Jan,National Taipei University, Taiwan;
Prof. Fei Yuan,Ryerson University,Canada;
Prof. Zhi-Jian Xie,North Carolina A&T State University, USA.
Advisory Chairs:
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA;
Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan.
Conference Chairs:
Prof. Zhigong Wang, Southeast University, China;
Prof. Li Qiang, University of Electronic Science and Technology of China, China.
Conference Co-Chair:
Prof. Gene Eu Jan, National Taipei University, Taiwan.
Program Chairs:
Prof. Fei Yuan, Ryerson University, Canada;
Prof. Zhi-Jian Xie, North Carolina A&T State University, USA.
Steering Committee Chair:
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China.
Technical Committee:
Prof. Bo Yan, University of Electronic Science & Technology of China, China;
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India;
Prof. Xiaoxiao Wang, BeiHang University, China;
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China;
Prof. Jinzhao Wu, Guangxi University for Nationalities, China;
Prof. Shiwei Feng, Beijing University of Technology, China;
Assoc. Prof. Wei Ni, Hefei University of Technology, China;
Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China;
Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China;
Prof. Jinyan Wang, Peking University, China;
Prof. Zhi-Jian Xie, NC A&T State University, USA;
Prof. S. Ushakumari, College of Engineering Trivandrum, India;
Prof. Lu Tang, Southeast University, China;
Prof. Haizhi Song, University of Electronic Science and Technology of China, China;
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China;
Prof. Shiwei Feng, Beijing University of Technology,China;
For more members, please visite conference website: http://www.icicm.net/committee.html